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It is created ion or radical to have high reaction nature by accelerated electron When gas molecular in
chamber of low vacuum status is subjected to sufficient energy.
These ions and radicals accelerated by continual collision, electric attraction induce physical/chemical
change by striking surface of materials to break down its molecular integrity within several ㎛ range
which peel off surface of hole or create micro-rough/functional group of gas ingredient in order to
desmear and enhance plating strength.
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 Applications : Micro hole Desmear of Build-up
PCB/MLB PCB, Plating strength enhancement
in surface of hole (prevention of Hole void)
Materials of PCB : PTFE, PPE, Rigid PI, High Tg materials, Fr-4
Chambe Size : 1,500 X 1050 X 980 (mm)
Power
PCB Size : Max 810 * 610
Q?y of PCB : 25 Sheets per cycle
Process time : 20~50 min (Depend on materials, Drill condition)
Loading Type : Auto loading/unloading
Process control : Touch Screen
Gas : Ar, N2, H2, O2, CF4
Jig loading : Upside
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Applications : Micro hole Desmear of Build-up
PCB/MLB PCB, Plating strength enhancement in surface of hole (prevention of Hole void) Materials of PCB : PTFE, FPC, R-FPC, High Tg materials, Fr-4
Chambe Size : 700 X 700 X 850 (mm)
Power
PCB Size : Max 500 * 500, Min 395 *290
Q?y of PCB : 16 Sheets per cycle in 500,
32 Sheets per cycle in 250
Process time : 15~30 min (Depend on materials, Drill condition)
Loading Type : Manul loading/unloading
(exchange jig composed of 2set)
Process control : Touch Screen
Gas : Ar, N2, H2, O2, CF4
Jig loading : Front slide Loading
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